1530 Process Probe

• Temperature Range: 0°C to 1100°C
• TC Absolute Temperature Accuracy: ±1.1°C or ±0.4% of reading, whichever is greater, in isothermal chamber environment
• Sensor to Sensor Precision: <±0.1°C in Cold Wall Chamber
  <±0.3°C ±2.0°C (system and temperature dependent)
• Number of Sensors: 1 to 34
• Sensor Type: Type K, (special limits)
• Sensor Lead Diameter: 0.003 in. (0.075 mm)
• Sensor Lead Insulation:
  0-1100°C – Quartz micro tube segments or braided silica sleeving
  0-250°C – PTFE or silicon rubber sleeving
• Wafer Sizes: 50 to 300 mm (2 to 12 inches)
• Substrate Types: Silicon, GaAs, Glass and Ceramic. Or customer supplied bare, coated, or patterned substrates
• Connector Options: 80-pin Hirose HDS, D-subminiature (up to 37 pins)
  2-pin subminature plugs
• Data Acquisition and Analysis Options: Thermal MAP® Metrology System with ISIS 5: Laptop-based acquisition and analysis. Thermal TRACK™ Measurement System with ISIS 5: PDA-based acquisition and monitoring.

1535 Process Probe

• Temperature Range: 0°C to 1100°C
• TC Absolute Temperature Accuracy: ±1.5°C or ±0.25% of reading (whichever is greater)
• Sensor to Sensor Precision: <±0.1°C in Cold Wall Chamber
  <±0.1°C ±2.0°C (system and temperature dependent)
• Number of Sensors: 1 to 34
• Sensor Type: Type R, or Type S
• Sensor Lead Diameter: 0.005 in. (0.125 mm)
• Sensor Lead Insulation: 0-1100°C – Quartz microtube segments or braided silica sleeving
  0-250°C – PTFE or silicon rubber sleeving
• Wafer Sizes: 50 to 300 mm (2 to 12 inches)
• Substrate Types: Silicon, GaAs, Glass and Ceramic. Or customer supplied bare, coated, or patterned substrates
• Connector Options: 80-pin Hirose HDS, D-subminiature (up to 37 pins)
  2-pin subminature plugs
• Data Acquisition and Analysis Options: Thermal MAP® Metrology System with ISIS 5: Laptop-based acquisition and analysis. Thermal TRACK™ Measurement System with ISIS 5: PDA-based acquisition
  and monitoring.

1630 Process Probe

• Temperature Range: 0°C to 800°C
• Accuracy: ±1.1°C or ±0.4% of reading (whichever is greater)
• TC-to-TC Matching: <±0.1°C
• Number of Sensors Available: 1, 3, 5, 8, 12, or 16
• Sensor Type: Type K, Chromel-Alumel (special limits)
• TC Lead Diameter: 0.003 in. (0.075 mm) inside a 0.02 in. (0.5 mm) sheath
• TC Sheath: Inconel (sheaths are braided when 3 or more TCs are supplied)
• Wafer Diameters: 100 to 300 mm (4 to 12 inch)
• Connectors: Type K 2-pin subminiature plug
• Substrate Types: Silicon, GaAs, Glass and Ceramic. Or customer supplied bare, coated, or patterned substrates

1730 Process Probe

• Temperature Range: -150°C to 300°C
• Accuracy: ±1.1°C or ±0.4% of reading (whichever is greater)
• TC-to-TC Matching: <±0.1°C
• Temperature Repeatability: ±0.1°C
• Number of Sensors Available: 1 to 34
• Sensor Type: Type K, Chromel-Alumel (special limits)
• TC Lead Diameter: 0.003 in. (0.075 mm)
• TC Insulation: Polyimide Coating
•  Flat Cable: Polyimide flat cable. Seal is made under chamber o-ring
• Wafer Sizes: 50 to 300 mm (2 to 12 inches)
• Connectors: Type K 2-pin subminiature plug, D-subminiature (9, 15, 25, 37, or 50-pin)
  Open Wire, U-shaped terminal (Spade Lug)
• Substitute Types: Silicon, GaAs, Glass and Ceramic. Or customer supplied bare, coated, or patterned substrates
• SensArray Datalogging Systems: Thermal MAP® 3 Complete Temperature Metrology System, Thermal TRACKTM 4 Portable Measurement System

1840 Process Probe

• Temperature Range: 0°C to 250°C
• Sensors Available: 1 to 34
• Resistor Element: Thin Film Platinum
• Element Resistance: 1000W nominal at 0°C
• Resistance vs. Temp: 0.00375W/W/°C
• Maximum Measurement Current: 200µA
• Accuracy with Calibration Correction: ±0.1°C absolute accuracy ±0.03°C sensor to sensor accuracy traceable to NIST standard ITS 90
• Type of Connection: Four-wire resistance measurement with common current source return
• Lead Materials: Polyimide coated copper
• Cable Construction: Polyimide film flat cable section transitioning to a silicon rubber round flex cable. The flat portion can be used as feedthrough under chamber seals.
• Connector: D-type, high density, sub-miniature with 44 or 62 pins.
  (2 connectors for 18-34 sensors per wafer.)
• Wafer Sizes: 50 mm to 300 mm
• Substrate Types: Silicon, GaAs, Glass and Ceramic. Or customer supplied bare, coated, or patterned substrates
• SensArray Datalogging Systems: Thermal MAP® 3 Complete Temperature Metrology System, Thermal TRACKTM 4 Portable Measurement System

1410 Temperature Probes

• Type: RTD (Thin Film Platinum)
• Temperature Range: 0°C to 230°C
• Element Resistance: 1000 nominal at 0°C
• ΔResistance vs. Temp.:
  0.00375//0°C
• Max Measurement Current: 200µA
• Accuracy with Calibration Correction: ±0.1°C absolute accuracy, ±0.03°C sensor-to-sensor accuracy
• Type of Connection: Four-wire resistance measurement with common current source return

1420 Humidity Probe

• Range: 10% to 80% Relative Humidity
• Accuracy: ±1% (including hysteresis and drift)
• Operating Temp. Range: -40°C to + 60°C
• Typical long term Stability: 1% RH per year or better
• Temperature Dependence: ±0.05% RH/°C
• Size: 1 inch dia. 10 inch length

1430/1435 Air Velocity Probe

• Range: 1430: 15 to 200 ft/min
  Range: 1435: 30 to 1000 ft/min
• Accuracy: ±2% FS at 21°C (including hysteresis and drift)
  1430: ±4 ft/min
  1435: ±20 ft/min
• Operating Range: 0°C to + 70°C
• Size: 23mm x 7mm x 3mm

Thermal MAP 3 with
ISIS 5

• Sophisticated electronics for data acquisition
• Advanced, wireless ISIS 5 hardware
• Powerful, graphical software for visualization and analysis
• Wireless data communication between the laptop and the ISIS 5
• Develop contour and surface maps to aid correlation to thickness and resistivity maps
• Create animation for rapid viewing of temperature profile changes during the process
• Perform run-to-run and within run analysis
• Thermal MAP software is available in both a full edition and an analysis only edition

Thermal TRACK 5 with ISIS 5

• Real-time process measurements on a Pocket PC-based PDA
• Uses Bluetooth™ wireless technology to communicate with the ISIS 5 data acquisition module
• Portable, accurate, and cost-effective

APTOS 2

• In-situ real time wafer temperature measurement
• Wider temperature range
• Capturing wafer temperature data for characterization and optimization of your equipment and process
• Measuring real time wafer temperatures within 3mm of the wafer edge, and across the entire wafer
• Recording the entire thermal history of a process from ramp up to cool down
• Utilizing a wide temperature range from –60°C to 420°C, with ±1°C accuracy and ±0.5°C repeatability for a wide range of processes
• Advanced real time temperature data display and analysis capabilities for real time adjustment and optimization of your fab equipment

Accura°C Metrology System

• Real-time process optimization of advanced track systems with two or more robot arms
• Accurate temperature mapping of the entire bake sequence
• Provides highly accurate transient and steady state temperature measurements
• Delivers the data instantly to your PC via a Bluetooth™ wireless RF link