|
Fused Lead Frame
|
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Lead frame with highly
efficient heat
dissipation method, by
connecting inner lead.
|
|
|
Multi Pad
|
-
SYSTEM I.C equipped with
2 more pads on lea Unit.
|
|
|
Reduces Pad
|
-
Structure preventing
delamination of PKG with
pad size minimizing
technological
requirements.
|
|
|
MLF
|
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Metal CSP with half
etching application
Technological
requirements.
|
|
|
New Matrix
|
-
Strip Length: 250mm
-
Strip Width: 70mm
-
Max. 170 Units/Strip
|
|
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Micro BGA (Micro Ball Grid
Array) Tape Substrate
|
-
Applies ribbon lead.
-
Applies elastomer attach
process.
|
|
|
FBGA (Flex Ball Grid Array)
Tape Substrate
|
-
SR/PSR Printing Process.
-
Ni/Au Plating Process.
-
Fine Pitch Etching.
|
|
|
TBGA (Tape Ball Grid Array)
Tape Substrate
|
-
PSP Printing Process.
-
Ni/Au Plating Process.
-
Fine Pitch Etching.
-
Stiffener Attach
Process.
|
|
